ASUS has launched its B850M AYW GAMING WiFi motherboard worldwide giving users a small but mighty option for AMD Ryzen desktop systems. This board comes in a narrow microATX form factor measuring 24.4 cm x 22.1 cm. It sports a six-layer black PCB and silver-white heatsinks keeping a tidy look while sticking to the ASUS AYW series style. The board uses an 8+2+1 phase setup with discrete MOSFETs and has one 8-pin EPS CPU power plug. For a compact board, it offers plenty of storage choices. You'll find one PCIe 5.0 M.2 slot that can handle speeds up to 128 Gbps and another PCIe 4.0 M.2 slot with speeds up to 64 Gbps. To add extra cards, the motherboard provides one PCIe 5.0 x16 slot running at full speed plus one PCIe 4.0 x16 slot that works at x8/x4 speed.

The B850M AYW GAMING WiFi has two DIMM slots for DDR5 memory in a dual-channel setup with AEMP support (up to 8400+ MS/s OC). It comes with Wi-Fi 6 wireless networking, 2.5 Gigabit Ethernet, various USB ports, including Type-C, and Realtek 7.1 channel audio CODEC. You'll find a pre-mounted shield on the rear I/O panel. This panel includes one HDMI 2.1 port, several USB ports at different speeds (10 Gbps, 5 Gbps, and 480 Mbps), one 2.5 GbE RJ45 network port, two Wi-Fi antenna connections, and three audio jacks. For those looking to customize, the board offers three Addressable RGB Gen 2 headers. Exact pricing is yet to be revealed.

Kioxia Corporation, AIO Core Co., Ltd. and Kyocera Corporation today announced the development of a prototype of a PCIe 5.0-compatible broadband SSD with an optical interface (broadband optical SSD). The three companies will develop technologies for broadband optical SSDs to enhance their suitability for advanced applications that require high-speed transfer of large data, such as generative AI, and will also apply them to proof-of-concept (PoC) tests for future social implementation.

The new prototype achieved functional operation with the high-speed PCIe 5.0 interface, which is twice the bandwidth of the previous PCIe 4.0 generation, through the combination of AIO Core's IOCore optical transceiver and Kyocera's OPTINITY optoelectronic integration module technologies. In next-generation green data centers, by replacing the electrical wiring interface with optical and utilizing broadband optical SSD technology significantly increases the physical distance between the compute and storage devices, while maintaining energy efficiency and high signal quality. It also contributes to the flexibility and efficiency of data center system design, where digital diversification and the evolution of generative AI require complex, high-volume, high-speed data processing.

Colorful recently teased its new CVN motherboards series based on the AMD X870 chipset, and now the first model, CVN X870 ARK FROZEN V14, has been listed on the Colorful website. This motherboard marks the debut of Colorful's first-generation graphics card quick-release mechanism, featuring an "ON or OFF" switch placed just below the memory slots. Colorful advertises this proprietary design as being "really safe". The CVN X870 ARK FROZEN V14 motherboard features a standard ATX form factor with a striking white PCB and frost-themed heat dissipation armor. It boasts a 14+2+1 phase power supply design with 80 A DrMOS components and dual 8-pin EPS connectors for CPU power. In terms of memory, it has four DDR5 memory slots supporting up to 192 GB (single slot up to 48 GB) and allows up to 8000 MHz overclocked memory modules.

The PCIe configuration includes a PCIe 5.0 x16 slot directly connected to the CPU with metal reinforcement and quick-release support, a full-length PCIe 4.0 x4 slot (which shares lanes with the third M.2 slot), and a PCIe 4.0 x1 slot. For storage, users get two PCIe 5.0 x4 M.2 slots directly connected to the CPU and one PCIe 4.0 x4 M.2 slot via the chipset, which is mutually exclusive with the second PCIe slot. Additionally, the board includes four SATA III 6 Gbps ports. Networking options include a Realtek RTL8126-CG chip offering 5GbE wired connectivity and a MediaTek MT7925 module supporting Wi-Fi 7 and Bluetooth 5.4. The Realtek ALC1220 CODEC powers audio. The rear I/O provides HDMI 2.0, DisplayPort 1.2, multiple USB-A ports, a USB-C port with 40 Gbps bandwidth and DP Alt Mode support, a 5GbE RJ45 port, dual Wi-Fi antenna connectors, an S/PDIF out, and five standard audio jacks. According to ITHome, Colorful previously announced that the CVN X870 ARK FROZEN V14 will begin shipping around mid-April, pricing is yet to be revealed.

ASUS today announced its participation in the NAB Show 2025. Visitors to the ASUS booth will have the opportunity to experience the future of content creation with live demonstrations of the latest ASUS ProArt offerings. The showcase includes the debut of the ProArt Cinema PQ09 monitor, featuring the largest-ever ASUS microLED display. The ProArt Display 6K PA32QCV and the ProArt CaliContrO MCA02 three-in-one calibrator will also be showcased. Also on show will be the 16-inch ProArt P16, a creative powerhouse laptop equipped with a 50 TOPS NPU, AMD Ryzen AI 9 HX 370 processor, and up to an NVIDIA GeForce RTX 5070 Laptop GPU. In addition, the NAB Show 2025 will feature the latest installment of the ProArt Masters' Talks series, with renowned creatives sharing their perspectives on current trends.

The ProArt Cinema PQ09 is the latest addition to the ProArt Cinema microLED display lineup. This 162-inch 4K HDR monitor features advanced panel technologies, ultrasmall 0.93 mm pixel pitch, 1200nits peak brightness, high 1,000,000:1 contrast ratio, and 97% DCI-P3 color gamut. Compared to conventional microLED displays with a 1.2 or 1.5 mm pixel pitch, ProArt Cinema PQ09 delivers smoother and more vibrant visuals, making it the perfect large-screen display for home cinema, broadcasting or other uses.

Altera Corporation, a leader in FPGA innovations, today announced production shipments of its Agilex 7 FPGA M-Series, the industry's first high-end, high-density FPGA to feature integrated high bandwidth memory and support for DDR5 and LPDDR5 memory technologies. Offering over 3.8 million logic elements, Agilex 7 FPGA M-Series is optimized for applications that demand the highest performance and highest memory bandwidth, including AI, data centers, next-generation firewalls, 5G communications infrastructure and 8K broadcast equipment.

As data traffic continues to increase exponentially due to the growth of AI, cloud computing and video streaming services, the demand for higher memory bandwidth, increased capacity, and improved power efficiency has never been greater. Agilex 7 FPGA M-Series addresses these challenges by offering users high logic densities, a high-performance fabric and a memory interface that accelerates data throughput speeds while reducing memory bottlenecks and latency.

PC hardware media outlets have uncovered a not yet officially announced Kingston Fury Renegade G5 SSD product family. Promotional images and fairly detailed specifications were reportedly sourced directly from the North American manufacturer's main web presence. Three next-gen PCIe 5.0 SSD options were highlighted; likely coming soon—in quick response to Samsung's recently launched 9100 PRO Series. The South Korean megacorp's cutting-edge proprietary Presto
S4LY027-controlled offerings are considered to be the world's fastest SSDs, but this elite level of performance has arrived with substantial price tags. At several points, W1zzard's evaluation of the $300 Samsung 9100 Pro 2 TB model touched upon cost-performance considerations. Kingston's forthcoming Fury Renegade G5 4 TB, 2 TB, and 1 TB SSD NVMe M.2 2280 SKUs possess the potential to match main rivals—according to a leaked spec chart, the flagship boasts up to 14,800 MB/s read and 14,000 MB/s write speeds.

The apparent selection of Silicon Motion's SM2508 controller is a key point of interest—this "superior performance" low-power PCIe Gen 5 x4 NVMe 2.0 SSD solution was announced late last summer. September preview material painted a promising picture, in terms of promised power efficiency. By late December, a Chinese manufacturer demonstrated 14.5 GB/s sequential reads enabled by Silicon Motion's flagship controller. At CES 2025, TechPowerUp staffers documented a handful of previewed SM2508-controlled commercial products. Returning to the present day, Kingston's inadvertent self-leak did not reveal Fury Renegade G5's eventual launch window or price brackets—these facts are expected to arrive online with a possible imminent issuing of official press material.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the launch of its latest B760 GEN5 motherboards featuring full-line PCIe Gen 5 x16 support that dramatically elevates graphics processing capabilities to new heights. The "GEN5" suffixed to the model names represents that these new B760 motherboards are designed with future compatibility in mind, which perfectly support the latest GeForce RTX 50 series and Radeon RX 9000 series graphics cards.⁠

The new B760 GEN5 motherboards harness the full potential of PCIe Gen 5's doubled bandwidth, delivering lightning-fast frame rates, reduced latency, and superior visual fidelity that gives competitive gamers the critical edge needed to win. For content creators and professionals, this translates to significantly faster rendering times and smoother workflow with even the most demanding visual applications.⁠

Kioxia's LC9 Series 122.88 TB NVMe SSD was photographed on the show floor at NVIDIA's GTC 2025 by Tom's Hardware, revealing the first production-ready implementation of the company's BiCS FLASH generation 8 3D QLC technology with 2 Tb die density. The 2.5-inch form factor drive delivers immense storage density in the enterprise SSD market on a PCIe 5.0 connection. The LC9 Series features a dual-port design providing 32 GT/s throughput via PCIe 5.0 1x4 or 2x2 configurations, with NVMe 2.0 and NVMe-MI compliance. Built specifically to address density requirements for AI workloads, the drive leverages CMOS directly Bonded to Array (CBA) technology in its flash architecture. The enterprise-class unit is rated at 0.3 drive writes per day (DWPD) and 67,000 TBW endurance, positioning it for read-intensive applications rather than write-heavy workloads. The reported read speeds are around 15 GB/s, as demonstrated at the booth.

The LC9 supports vector database operations through Kioxia's AiSAQ technology implementation, which transfers vector database operations from DRAM to SSD storage. This approach significantly reduces system-level costs while maintaining acceptable latency profiles for AI RAG operations. Kioxia demonstrated the SSD at booth #1811 at the San Jose McEnery Convention Center through March 21, with live performance demonstrations highlighting its capabilities in AI dataset retrieval operations. The drive represents a critical advancement for enterprise AI infrastructure where data density and retrieval speeds are becoming bottlenecks in scaled LLM deployments. A massive capacity will allow entire enterprises to operate AI LLMs on top of company data with RAG and at low latency and high endurance.

ASUS today announces its groundbreaking AI supercomputer, ASUS Ascent GX10, powered by the state-of-the-art NVIDIA GB10 Grace Blackwell Superchip. This revolutionary device places the formidable capabilities of a petaFLOP-scale AI supercomputer directly onto the desks of developers, AI researchers and data scientists around the globe.

As the size and complexity of generative AI models grow, local development efforts face increasing challenges. Prototyping, tuning and inferencing large models require substantial memory and compute performance. To address these needs, Ascent GX10 is designed to provide developers with a powerful, economical desktop solution for AI development.

Acer today unveiled its latest Predator BiFrost and Acer Nitro graphics cards, powered by the next-generation AMD Radeon RX 9000 Series GPUs. This cutting-edge line-up includes six models designed to elevate gaming and creative experiences with next-level performance and visual fidelity. The models include the Predator BiFrost Radeon RX 9070 XT OC 16GB, Predator BiFrost Radeon RX 9070 OC 16GB, and four Nitro graphics cards: Acer Nitro Radeon RX 9070 XT OC 16GB, Acer Nitro Radeon RX 9070 OC 16GB, and standard versions of the Acer Nitro Radeon RX 9070 XT 16GB and Acer Nitro Radeon RX 9070 16GB.

The new GPUs are engineered for ultra-fast gaming and demanding tasks, leveraging AMD RDNA 4 compute units and up to 16 GB of memory to deliver immersive 8K visuals. The advanced cooling technology, featuring three FrostBlade 4.0 fans, and reinforced designs ensures systems can be pushed to their limits while maintaining peak performance. DIY gamers will appreciate new software features such as Acer Intelligence Space, which offers intuitive AI system detection, and Acer Game Assistance's adaptive aim system to give players a competitive edge.

KIOXIA America, Inc. today announced the development of its new LC9 Series 122.88 terabyte (TB) capacity NVMe SSD in a 2.5-inch form factor - the first SSD built with the company's BiCS FLASH generation 8 3D flash memory technology QLC 2 terabit (Tb) die.

As AI systems become increasingly sophisticated, and data volumes continue to grow, enterprises require storage solutions that can keep pace with the complex demands of modern workloads. High-capacity drives are critical for certain phases of the AI process, including large language models (LLMs), training and storing vast datasets, vector databases and the rapid retrieval of information for inference and fine-tuning. Designed for generative AI applications, the new enterprise-class KIOXIA drive is built for capacity and provides a PCIe 5.0 interface and dual-port capability for fault tolerance or connectivity to multiple compute systems. These high-capacity QLC-based SSDs are suitable for deploying in hybrid cloud and multi-cloud systems. High-capacity SSDs feed training and inference data to AI server systems via these cloud configurations.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is introducing a wide range of new systems which are fully optimized for edge and embedded workloads. Several of these new compact servers, which are based on the latest Intel Xeon 6 SoC processor family (formerly codenamed Granite Rapids-D), empower businesses to optimize real-time AI inferencing and enable smarter applications across many key industries.

"As the demand for Edge AI solutions grows, businesses need highly reliable, compact systems that can process data at the edge in real-time," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we design and deploy the industry's broadest range of application optimized systems from the data center to the far edge. Our latest generation of edge servers deliver advanced AI capabilities for enhanced efficiency and decision-making close to where the data is generated. With up to 2.5 times core count increase at the edge with improved performance per watt and per core, these new Supermicro compact systems are fully optimized for workloads such as Edge AI, telecom, networking, and CDN."

Kingston has introduced its new DC3000ME line of enterprise-grade PCIe 5.0 SSDs. These top-tier storage devices come in a U.2 15 mm form factor (100.50 mm × 69.8 mm × 14.8 mm) and use 3D eTLC NAND flash memory. The drives include built-in power loss protection and AES 256-bit hardware-based encryption. Kingston DC3000ME SSDs are designed for server applications such as AI, HPC, OLTP, databases, cloud infrastructure, and edge computing. As an enterprise-grade product, the DC3000ME SSDs also feature various built-in telemetry such as media wear, temperature, health, etc.

At this moment, they are offered in three sizes: 3.84 TB, 7.68 TB, and 15.36 TB. Each version has 1DWPD durability with a 5-year warranty. In terms of power consumption, we have 8 W when idle and up to 24 W during writing operations. Kingston points out the drives' steady I/O performance and quick response times, with read delays under 10µs at 99% and write delays under 70µs. (up to 14,000/10,000 MB/s sequential read/write and up to 2,800,000/500,000 4k random read/write IOPS). The drives also have NVMe-MI 1.2b remote management, end-to-end data safety, and support for TCG Opal 2.0. Exact pricing is still to be announced, however we found them online at €686,9 (3.84 TB), €1226,9 (7.68 TB), €2252,9 (15.36 TB).

Embedded World is one of the most influential exhibitions in the global embedded technology sector, attracting numerous experts in industrial computing, automotive electronics, IoT, and AI technologies each year. Phison Electronics (8299TT), a leading innovator of NAND controller and NAND storage solutions, will participate in the Taiwan Excellence Pavilion at Embedded World 2025 in Germany from March 11 to 13.

Phison will showcase its exclusive AI solution aiDAPTIV+, the enterprise ultra-high-capacity PASCARI PCIe 5.0 122.88 TB SSD, and its latest automotive storage technology, the MPT5 Automotive PCIe Gen 4 SSD, demonstrating over 15 years of technical expertise in the embedded market.

Advantech, a leading provider of edge computing and edge AI solutions, is pleased to announce their high-performance server and network appliances are now powered by the latest AMD EPYC Embedded 9005 Series processors. By leveraging these cutting-edge platforms, Advantech is driving edge computing and AI to new heights—making solutions ideal for 5G edge cloud, AI, machine learning, and enhanced data security.

"We are excited about the launch of Advantech's latest generation of innovative edge computing and AI solutions powered by AMD EPYC Embedded 9005 Series processors," said Amey Deosthali, Senior Director of embedded core markets at AMD. "Optimized for embedded markets, EPYC Embedded 9005 provides exceptional compute performance for edge AI applications while delivering enhanced IO capabilities, product longevity, and system resiliency."

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, introduces the CVN B850I GAMING FROZEN Mini-ITX motherboard for the Ryzen 9000 Series processors. The CVN B850I GAMING FROZEN is a compact yet powerful Mini-ITX motherboard featuring a sleek design that blends geometric slanted lines with military-inspired elements. It is equipped with a dedicated PCIe 5.0 M.2 heatsink and CNC composite cooling grooves, enhancing thermal efficiency while emphasizing the motherboard's rugged and durable construction.

Built with the B850 chipset, the CVN B850I supports AMD Ryzen 7000, 8000, and 9000 series processors. It features a 10-layer high-speed PCB with a 9+2+1 phase power delivery system, ensuring stable performance even for the high-end Ryzen 9 9950X. Additionally, the second-generation memory routing design enables support for up to 8000 MHz dual-channel DDR5 memory. The motherboard also includes a PCIe 5.0 GPU slot, dual front and rear Type-C 10G ports, and a Wi-Fi 6E module, making it ideal for building a high-performance, wireless Ryzen-based system.

NVIDIA has prepared a "Blackwell" Titan equivalent—RTX PRO 6000 Blackwell GPU for professional visualization and local AI solutions. Based on the GB202 silicon, the RTX PRO 6000 is the closest solution to the full power of NVIDIA's prosumer-oriented Blackwell SKUs. With 24,064 CUDA cores on board, this configuration is just 512 CUDA cores shy from the complete GB202 24,576-core configuration. This is likely due to the yield defects, meaning that this is perhaps the highest CUDA core count model we will see based on GB202. Additionally, at 24,064 core RTX PRO 6000 Blackwell is carrying 2,340 more cores than the top-end consumer GeForce RTX 5090 with 21,760 CUDA cores. Based on the 600 W TGP, the new RTX PRO 6000 Blackwell should have lower clocks, given its bigger core count to maintain the TGP for its massive memory configuration. Remember, GDDR7 memory modules consume power, too.

With 96 GB of GDDR7 memory and ECC memory correction on board, it will primarily target professionals in 3D rendering, simulations, and local AI development. To cool the beastly configuration, NVIDIA opted for a double-flow-through cooler used on the RTX 5090, with an open-air design. Operating on a PCIe 5.0 x16 interface with four DisplayPort 2.1 connectors, the design remains double-slot in thickness. VideoCardz obtained pictures of it, which you can see below. Interestingly, the color accents of the new cooler are darker. We can expect to see more from NVIDIA and its new RTX PRO 6000 Blackwell GPU from the upcoming GTC 2025 on March 17.

Avalue Technology introduces the HPM-GNRDE high-performance server motherboard, powered by the latest Intel Xeon 6 Processors (P-Core) 6500P & 6700P.

Designed to deliver quality computing performance, ultra-fast memory bandwidth, and advanced PCIe 5.0 expansion, the HPM-GNRDE is the ideal solution for AI workloads, high-performance computing (HPC), Cloud data centers, and enterprise applications. The HPM-GNRDE will make its debut at embedded world 2025, showcasing Avalue's innovation in high-performance computing.

Credo Technology Group Holding Ltd (Credo) an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency, today announced that its PCI Express (PCIe) 5.0 specification capable "Toucan" retimer has successfully passed the testing at the PCI-SIG Compliance Workshop #133 in Taipei. This milestone confirms the retimer's compliance with the rigorous standards required for PCIe 5.0 technology integrations, and it now will be officially listed on the PCI-SIG Integrators List.

"We are excited to announce that our Toucan retimer has passed the PCI-SIG Compliance Workshop, a critical step in ensuring Credo's PCIe technology solutions seamlessly integrate into the evolving high-performance AI infrastructure," said Phil Kumin, AVP of Product for PCIe/CXL at Credo. "Considering that retimers are required to undergo extensive testing, this achievement not only reinforces our leadership in high-speed connectivity but also provides our customers with the confidence that Credo's products meet the highest standards of interoperability and performance."

Samsung Electronics America, a world leader in advanced memory technology, today announced the 9100 PRO series solid state drives (SSDs), the newest addition to its consumer SSD lineup. Featuring blazing fast speeds and even more storage capacities, the 9100 PRO and 9100 PRO with Heatsink SSDs are designed to deliver next-gen performance - offering the ultimate storage solution for your digital life.

"From AI-driven creators shaping the future to gamers pushing the limits, we saw a clear need for innovation to support users who need more forward-thinking memory technology as they push the bounds of what's possible in their work," said Jim Kiczek, Vice President of Memory Product Marketing at Samsung Electronics America. "The 9100 PRO SSD establishes a new era of performance to help them achieve exactly that. With more storage, even better speeds, improved power efficiency and seamless reliability, the lineup empowers users to continue innovating without storage limitations."

Although we've been aware of Samsung's 9100 Pro SSD since June last year, it appears that Samsung India got ahead of things and released a press release early about what we can only expect is a soon to launch product. The 9100 Pro is, as you'd expect, a PCIe 5.0 NVMe SSD and it will be available in capacities of 1, 2 and 4 TB initially, but it appears that Samsung is also planning to release an 8 TB SKU, which would be a first for its Pro series of SSDs. Samsung will offer all SKUs with or without a heatsink and the 1 to 4 TB versions will come with an 8.8 mm thick heatsink, whereas the 8 TB model will come with an 11.25 mm thick heatsink.

Sadly, Samsung India only shared the sequential performance figures, and we're looking at read speeds of up to 14,800 MB/s and write speeds of up 13,400 MB/s, neither is sticking out from the competition already available in the market. The pulled press release also mentioned random read performance of 2,200K IOPS and random write performance of 2,600K IOPS. As the press release was intended for the Indian market, we only have pricing in Indian rupees and the 1 TB SKU will sell for 14,999 INR or around US$172, including 18 percent VAT, followed by the 2 TB SKU at 25,499 INR or US$293 and finally 49,999 INR or US$573 for the 4 TB SKU. No pricing was revealed for the upcoming 8 TB SKU.

ASUS today announced an all-new series of servers powered by the latest Intel Xeon 6 processors, including the Xeon 6900-series, 6500P/6700P-series and 6300-series processors. These powerhouse processors deliver exceptional performance, efficiency and scalability, featuring up to 128 Performance-cores (P-cores) or 288 Efficient-cores (E-cores) per socket, along with native support for PCI Express (PCIe 5.0) and DDR5 6400 MT/s memory speeds. The latest ASUS server solutions also incorporate the updated BMC module within the ASPEED 2600 chipset, providing improved manageability, security and compatibility with a wide range of remote management software - and coincide with the unveiling of the latest Intel Xeon 6 processors.

Redefining efficiency and scalability
Intel Xeon 6 processors are engineered to meet the needs of modern data centers, AI-driven workloads and enterprise computing. Offering a choice between P-core and E-core architectures, these processors provide flexibility for businesses to optimize performance and energy efficiency based on specific workloads.

AEWIN is excited to launch the MIS-5131-2U2, a cutting-edge 2U2N High Availability Storage Server powered by Intel's latest Xeon 6 processors. The horizontal placement enables optimized thermal dissipation to allow CPU running with high TDP of 350 W. Each node is equipped with a single Intel Xeon 6700/6500-series processor with P-cores (R1S), offering up to 80 performance cores, 136 PCIe 5.0 lanes, and 8x high-speed DDR5 RDIMMs with speeds of up to 6400 MT/s. Featuring rich I/O and 24x hot-swap dual port NVMe SSD bays, MIS-5131-2U2 is a high-performance and reliable storage solution for mission-critical applications.

The dual node architecture within a single chassis allows for seamless failover through with the NTB (Non-Transparent Bridge) interconnectivity, two BMC communication, and dual-port NVMe drives. The two nodes of MIS-5131 are linked via NTB running at PCIe Gen 5 speeds (32 GT/s) to enable high speed, redundant storage failover. With NTB, dual port NVMe drives, and sufficient PCIe lanes of Intel Xeon 6 R1S CPU, the system eliminates the need for an additional switch, delivering an optimized HA server solution with the best TCO for continuous operation.

Intel today launched two new Ethernet product lines - the Intel Ethernet E830 Controllers and Network Adapters, and the Intel Ethernet E610 Controllers and Network Adapters - designed to meet the growing demands of enterprise, telecommunications, cloud, edge, high performance computing (HPC) and artificial intelligence (AI) applications. These next-generation solutions provide robust, high-performance connectivity while enhancing energy efficiency and security, and lowering total cost of ownership (TCO).

"In today's interconnected world, networking is essential to the success of business and technology transformation. With the launch of the Intel Ethernet E830 and E610 products, we are helping customers meet the growing demand for high-performance, energy-efficient solutions that optimize network infrastructures, lower operational costs and enhance TCO." -Bob Ghaffari, Intel vice president, Network and Edge Group

GIGABYTE introduced its STEALTH series motherboard design at last summer's Computex event; where TechPowerUp staffers inspected a B650E AORUS STEALTH ICE sample model. The Taiwanese manufacturer was readying new board SKUs with backside connectors (power and I/O); destined to take on similar products from rival companies. GIGABYTE's debut wave of STEALTH did not include any AMD X670 chipset-based options, but a recent ECC filing points to possible forthcoming X870-based models. A weekend sleuthing session—performed by harukaze5719—unearthed multiple registrations of X870 and B850 boards. Two unannounced STEALTH ICE models were highlighted in the regional registry.

The X870 and B850 AORUS STEALTH ICE models are expected to arrive within the coming months, reportedly sporting familiar white designs—as seen on GIGABYTE's current-gen option. Insiders believe that a high-end X870E-based offering will not emerge, due to STEALTH occupying a very niche market segment. According to a Chinese leaker, B850 models could arrive in ATX and microATX form factors. Further up in product hierarchies, they reckon that the X870 AORUS STEALTH series: "comes standard with PCIe 5.0 and DDR5 overclocking support. The flagship model comes with dual Thunderbolt 4 interfaces." GIGABYTE's back-connected X870 and B850 board designs could demand high asking prices; their current B650E AORUS STEALTH ICE is not readily available, but in some regions it is selling for $320+.